Pembuatan Edible Film dari Tepung Jagung (Zea Mays L.) dan Kitosan

Murni, Sri Wahyu and Pawignyo, Harso and Widyawati, Desi and Sari, Novita (2015) Pembuatan Edible Film dari Tepung Jagung (Zea Mays L.) dan Kitosan. In: Prosiding Seminar Nasional Teknik Kimia “Kejuangan” ISSN 1693-4393 Pengembangan Teknologi Kimia untuk Pengolahan Sumber Daya Alam Indonesia Yogyakarta, 18 Maret 2015, 18 Maret 2015, UPN "Veteran" Yogyakarta.

Text 5 sntkk 2015 edible fil lengkap.pdf Download (8MB)

Abstract

Food packaging is important that affect it’s quality, one of the safe packaging method is to use edible film.
Edible film is a thin layer that can be consumed, formed to coat the food that serves to maintain the food
quality, as mass transfer barrier (eg, moisture, oxygen, light, lipids, and solute). Edible film also can be
used a carrier substance additives to improve the food quality. This research aims to determine the
appropriate formulation of material to produce edible film with optimal characteristics. In this case the
main materials used are corn starch and chitosan with the addition sorbitol and glycerol as plasticizer.
Edible films made from cornstarch dissolved in distilled water and then heated till 85oC and chitosan
dissolved with a solution of 1% acetic acid. Both mixtures were mixed and then plasticizer sorbitol and
glycerol were added. After it is molded, and dried at 60°C in 7 hours; it is released from the mold, edible
film is ready to use. The results shows that the optimum formulation of edible corn starch and chitosan
films are edible film that formed from 7 grams cornstarch, 3 grams of chitosan, 1 ml of sorbitol and 1 ml of
glycerol, with physical characteristic is 21 , 45 % film solubility; 15,5597 MPa film tensile strength, and
water vapor permeability is about 3,089 × 10-8 g/m.s.kPa .
Keywords: edible film, cornstarch, chitosan

Item Type:	Conference or Workshop Item (Paper)
Uncontrolled Keywords:	edible film, cornstarch, chitosan
Subjects:	T Technology > TP Chemical technology
Depositing User:	Dra., M.T SRI WAHYU MURNI
Date Deposited:	18 Oct 2022 08:08
Last Modified:	18 Oct 2022 08:08
URI:	http://eprints.upnyk.ac.id/id/eprint/31381

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