Suryawati, Ami and Lagiman, Lagiman and Sutoto, Budi (2020) The Influence Of Delay Time And Pile Thickness Of Seed Drying On Seed Viability And Growth Of Rice (Oryza sativa L.) Using Innovated Drying Floor. In: Proceedings The 4th International Conference on Green Agro-Industry, 22-23 Oktober 2019, Grand Inna Malioboro.
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Abstract
Seeds were susceptible to drying injury in several ways i.e the delay time and the pile thickness of seed drying . The research was carried out to found the maximum delay time and the pile thickness to obtain the best seed viability and growth of rice using Innovated Drying Floor. This research was done from June to September 2019 at UPT Barongan Balai Benih Pertanian, Barongan, Sumber Agung Village, Bantul, Yogyakarta. The experiment was arranged on Split Plot design with two factors. The main plot was delay time of drying process: 2, 4 and 6 days. The subplot was the seed pile thickness: 3, 5, 7, and 9 cm. The treatments were repeated 3 times. Data were analyzed by analysis of variance 5% and test further with DMRT 5% (Duncan’s Multiple Range Test). The results showed that there was not interaction between the delay time and seed pile thickness on all parameters. The delay time of drying process: 2, 4 and 6 days and the seed pile thickness: 3, 5, 7, and 9 cm showed no significantly different on germination capacity and the growth of rice seed. The delay time of drying process until 6 days can be tolerated on the germination capacity and growth rice. The seed pile thickness until 9cm also can be tolerated on the germination capacity and growth rice. Key words: delay time, pile thickness, innovated drying floor, seed viability and growth of rice
| Item Type: | Conference or Workshop Item (Paper) |
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| Uncontrolled Keywords: | delay time, pile thickness, innovated drying floor, seed viability and growth of rice |
| Subjects: | S Agriculture > S Agriculture (General) |
| Depositing User: | S.P., M.Sc Danar Wicaksono |
| Date Deposited: | 25 Jun 2020 05:43 |
| Last Modified: | 25 Jun 2020 05:43 |
| URI: | http://eprints.upnyk.ac.id/id/eprint/22864 |
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